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Profiling
FLX Series
Precision surface stress analysis
With thermal cycling and ambient auto-rotation models available, the Toho FLX Thin Film Stress Measurement Systems offer Industry Standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates. Incorporating KLA-Tencor’s patented “Dual Wavelength” technology, Toho FLX Series tools precisely determine and analyze surface stress caused by deposited thin films. In-situ stress measurements can be made from -65°C to 500°C at heating rates up to 25°C per minute (the cooling unit to -65°C is optional). An understanding of stress variations with temperature is essential for characterizing material properties such as stress relaxation, moisture evolution, and phase changes.
Applications
With a stressed film, defects such as dislocations, voids, and cracking may occur. The FLX stress measurement system helps troubleshoot applications listed below:
• Aluminum stress-induced voids
• Passivation cracking (nitride, oxide)
• Stress-induced dislocations in silicon
• Electrical test yield degradation
• Tungsten silicide cracking
• Stress increase in oxides during temperature cycling
• Constant current stress test (CCST) degradation
• Matching metallization expansion on GaAs
• Silicon cracking due to high film stress
Film thickness
TohoSpec 3100
Accurate film thickness measurement
The TohoSpec 3100 is a low cost film thickness measurement system that utilizes a modern small spot spectroscopic reflectometer built on a simple-to-use tabletop platform. Incorporating core technology acquired from market leader Nanometrics, this system is specifically designed for a wide variety of R&D applications. The reliable solid state linear diode array provides fast, precise measurements of single-layer films such as oxide, nitride and photo-resist, as well as the top layer on film stacks of up to 3 layers in the thickness range of 100Å to 30µm. An outstanding value, complete with up to 15 standard film thickness measurement algorithms, this rugged and accurate system is used in laboratories worldwide to provide precision film thickness measurements in a compact design.
Applications
TohoSpec 3100 is designed to provide accurate film thickness measurements within a vast array of applications. Guaranteed 3 layer measurement and in some cases beyond 3 depending on parameters. Measures most smooth or semi-smooth surfaces with some reflectance
• LED
• Solar
• FPD/LCD
• OLED
• Photomask
• Power device
• SOI
• Magnetic head for HDD
